Board Thickness Rigid: 1.5mm +/-0.15 Flex: 0.13mm +/-0.03
Material FR4 TG170 +Polyimide (Adhesiveless)
Copper Thickness 1/1/1/1/1/1/1/1 OZ
Stiffener None
Min. Line Width/ Spacing 4mil (0.10mm)/4mil (0.10mm)
Coverlay Yellow
Silkscreen Color White
Solder mask Color Green
Surface Finishing ENIG（Ni: 3-5um/Au: 0.05um)
Layer Count 8 Layer （6rigid+2flex）
Impedance controlled 50Ω±10%, differential 100Ω ±10%
Min.Quantity of Order No MOQ
