Shenzhen Goldlink Tongda Electronics Co., Ltd
Shenzhen Goldlink Tongda Electronics Co., Ltd
China
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Shenzhen Goldlink Tongda Electronics Co., Ltd
Company Overview

Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority. Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.

Products
Our business includes Silicone Thermal Pad, Silicone Rubber Pad, Silicone Putty Pad, Silicone Thermal Tape, Thermal Interface Grease, Two-part Thermal Interface Sealing Compound, Silicone Thermal Gel, Thermal Interface Phase Change Materials and Non-Silicone type products.

Applications
We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.

Company Information
Company
Shenzhen Goldlink Tongda Electronics Co., Ltd
Business Type
Manufacturer
Main Products
thermal conductive heat transfer
Country
China
City / State
Shenzhen
Address
Room616-619 Huafengxin'an building 45dist. bao'an Shenzhen, Guangdong
Established Year
1997
Website
-
Factory Information
Location
Fuyong bao'an dist. shenzhen guangdong, China
Factory Size
6,000~10,000 square meters(m²)
Total QC Staff
5~10 people
Total RND Staff
21~40 people
Number of Production Lines
-
Annual output
US$ 10 Million ~ US$ 50 Million
Average Lead Time
10 days
Trading Information
Total Revenue
-
Export Percentage
-
Nearest Port
-
Overseas Office
-
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